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Layer 14, third section: combination of soft and hard materials
This 14-layer, three‑material rigid‑flex PCB features an integrated lamination of a rigid PCB and a flexible FPC. Components are mounted on the rigid section, while the flexible section allows for bending and three‑dimensional routing, eliminating the need for numerous connectors and ribbon cables and enhancing reliability. However, the manufacturing process is complex; applications such as foldable displays, endoscopes, and robotic arm joints require copper‑clad laminates and demand careful attention to bend life.
Category:
Rigid‑Flex Integration
- Product Description
- Application areas
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Number of floors 14th floor Plate thickness 0.3+1.3mm Materials PI-R-F775 12RB-M,FR4-EM-370(D) Surface treatment 2u immersion gold Minimum hole size 0.2mm Line width/line spacing 4mil/4mil Solder mask/characters Green oil + yellow cover film / white text
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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