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What are the standards for customer complaint rate and first-pass yield?

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Double-sided board yield: 98.8%; multilayer boards: 97.06%; HDI boards: 96.21%. Customer complaint rate ≤ 2%; on-time delivery rate ≥ 90%.
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How long is the shelf life of the finished product?

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Standard hot‑air solder leveling (HASL) and organic solderability preservative (OSP) boards can be stored for 6 months; immersion gold and nickel‑palladium‑gold, when sealed to protect against moisture, can be stored for 18 months—avoid high‑temperature, humid environments.
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What are the minimum hole diameter, minimum line width, and minimum line spacing?

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Laser-drilled blind vias: minimum 0.1 mm; mechanical vias: 0.15 mm; minimum trace width and spacing: 2 mil. Category 4: Qualifications, Export, Environmental Protection – Foreign Trade (for interfacing with overseas clients).
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What is the minimum board thickness for a rigid-flex PCB, and can it be bent?

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With a minimum board thickness of 0.4 mm, this is an FR4 rigid‑flex laminate that can be repeatedly bent, making it ideal for smart wearables and foldable devices.
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What is the maximum copper thickness achievable for thick copper boards?

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Thick copper PCBs with copper thicknesses ranging from 3 oz to 10 oz, suitable for high-power power supplies and charging station control boards.
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What surface treatments are available, and what applications are each suitable for?

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Optional finishes include immersion gold, nickel‑palladium‑gold, OSP, lead‑free hot‑air solder leveling, immersion tin, immersion silver, and anti‑oxidation treatments. Immersion gold: ensures stable soldering and is ideal for precision BGA assemblies. OSP offers excellent cost‑effectiveness for high‑volume production. Hot‑air solder leveling is well suited for high‑power power‑supply boards. Nickel‑palladium‑gold is recommended for long‑term storage of export‑oriented products.
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What type of laminate is used for high-frequency boards, and can impedance control be achieved?

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We can manufacture high-frequency laminates from Rogers, F4B, and Taconic materials, with full‑process impedance testing and tolerance control within ±10%, suitable for 5G RF and radar modules.
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What are the differences between HDI’s first-order, second-order, and any-layer configurations, and how should you choose?

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Single‑layer blind vias are suitable for standard smart hardware; stacked or staggered vias are ideal for graphics cards and portable devices; 8–26 layers with arbitrary interlayer connections are used in high‑end servers and precision medical instruments, and engineers can recommend solutions based on the board layout.
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What is the maximum number of layers you can produce for a PCB?

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Standard through-hole multilayer boards can have up to 64 layers; blind and buried HDI boards can have up to 32 layers; any-layer interconnect HDI boards can have up to 26 layers; and rigid‑flex boards can have up to 24 layers.
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If there are changes to the drawings, will the delivery date be extended?

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Free drawing revisions before placing your order; any changes made during production will halt the assembly line and extend the delivery schedule, so we recommend finalizing all requirements during the DFM review stage.
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