Welding Center


01
COMPANY BUSINESS

Company Business

The company currently operates three SMT production lines. As a leader in China’s SMT component‑mounting sector, it offers delivery within as little as 48 hours and standard turnaround within 96 hours, pioneering rapid SMT assembly capabilities in the industry.

The company is equipped with both SMT manual component‑placement and fully automated machine‑placement production lines, a ten‑zone reflow oven, a BGA rework station, AOI equipment, X‑ray inspection systems, electrically heated forced‑air drying ovens, intelligent anti‑static soldering irons, high‑frequency cleaning machines, and precision BGA rework workstations.

We have implemented a modern ERP management system to enable real-time monitoring of order‑production status, emphasizing institutionalized management, standardized processing workflows, and digitized quality control. Specifically, SMT component‑placement defects are tightly controlled within 100 ppm (parts per million), with a first‑pass yield exceeding 95% and a delivery‑quality rate of over 99.5%.

3 items SMT production line
48 hours Fastest delivery time
≤100PPM Patch Defect Control
More than 99.5% Delivery Qualification Rate
02
PROCESSING CAPABILITY

Processing capacity

SPECIFICATION

SMT and DIP Processing Parameters

Comparison of Mass Production with Sample and Small-Batch Processing Standards

Capability Classification Parameter Item Parameter range Batch Standard Sample/Small-Batch Standard
PCB Specifications for the Chip Component Length × Width L*W Minimum 50*50 L < 50 or W < 50
Maximum 680*508 680 < L ≤ 800 or
400 < W ≤ 508
Thickness T Thinnest 0.6 T < 0.6
Thickest 6 T > 6
PCB Specifications for DIP Length × Width L*W Minimum 50*50 L<50
Maximum 550*450 500 < L ≤ 1000 or
300 < W ≤ 450
Thickness T Thinnest 0.6 T < 0.6
Thickest 6 T > 6
Component Mounting Specifications External dimensions Size Minimum specification 0603 (0201) 0402 (01005)
Maximum size 50*50 50*50<Size≤
68*68 (45*150)
Component thickness 25.4 T > 25.4
QFP/SOP/SOJ/IC/power strip, etc. Minimum pin pitch Pitch=0.4 Pitch=0.3
CSP, BGA Minimum ball spacing Pitch=0.5 0.3≤Pitch<0.5
PCB process FR4, FPC, rigid-flex boards, etc.
03
DELIVERY CAPABILITY

Delivery capability

DELIVERY PLAN

Production Volume and Delivery Lead Time

The actual delivery time shall be calculated from the date when the documentation and materials have been confirmed to be free of any abnormalities.

Delivery Type Quantity range Delivery cycle
Sample Fewer than 100 pieces 3-4 days
Small batch 1,000–2,000 pieces 3–5 days
Batch 2,000–3,000 pieces In batches starting from 3 days.
Large quantity 3,000–5,000 or more Starting from 3 days, batches will be arranged according to customer requirements.
DELIVERY NOTES

Delivery Instructions

01

Product delivery begins to be counted once the documentation and materials have been confirmed as free of abnormalities.

02

Product deliverable pass rate: Min 98%.