Welding Center
Company Business
The company currently operates three SMT production lines. As a leader in China’s SMT component‑mounting sector, it offers delivery within as little as 48 hours and standard turnaround within 96 hours, pioneering rapid SMT assembly capabilities in the industry.
The company is equipped with both SMT manual component‑placement and fully automated machine‑placement production lines, a ten‑zone reflow oven, a BGA rework station, AOI equipment, X‑ray inspection systems, electrically heated forced‑air drying ovens, intelligent anti‑static soldering irons, high‑frequency cleaning machines, and precision BGA rework workstations.
We have implemented a modern ERP management system to enable real-time monitoring of order‑production status, emphasizing institutionalized management, standardized processing workflows, and digitized quality control. Specifically, SMT component‑placement defects are tightly controlled within 100 ppm (parts per million), with a first‑pass yield exceeding 95% and a delivery‑quality rate of over 99.5%.
Processing capacity
SMT and DIP Processing Parameters
Comparison of Mass Production with Sample and Small-Batch Processing Standards
| Capability Classification | Parameter Item | Parameter range | Batch Standard | Sample/Small-Batch Standard |
|---|---|---|---|---|
| PCB Specifications for the Chip Component | Length × Width L*W | Minimum | 50*50 | L < 50 or W < 50 |
| Maximum | 680*508 | 680 < L ≤ 800 or 400 < W ≤ 508 |
||
| Thickness T | Thinnest | 0.6 | T < 0.6 | |
| Thickest | 6 | T > 6 | ||
| PCB Specifications for DIP | Length × Width L*W | Minimum | 50*50 | L<50 |
| Maximum | 550*450 | 500 < L ≤ 1000 or 300 < W ≤ 450 |
||
| Thickness T | Thinnest | 0.6 | T < 0.6 | |
| Thickest | 6 | T > 6 | ||
| Component Mounting Specifications | External dimensions Size | Minimum specification | 0603 (0201) | 0402 (01005) |
| Maximum size | 50*50 | 50*50<Size≤ 68*68 (45*150) |
||
| Component thickness | 25.4 | T > 25.4 | ||
| QFP/SOP/SOJ/IC/power strip, etc. | Minimum pin pitch | Pitch=0.4 | Pitch=0.3 | |
| CSP, BGA | Minimum ball spacing | Pitch=0.5 | 0.3≤Pitch<0.5 | |
| PCB process | FR4, FPC, rigid-flex boards, etc. | |||
Delivery capability
Production Volume and Delivery Lead Time
The actual delivery time shall be calculated from the date when the documentation and materials have been confirmed to be free of any abnormalities.
| Delivery Type | Quantity range | Delivery cycle |
|---|---|---|
| Sample | Fewer than 100 pieces | 3-4 days |
| Small batch | 1,000–2,000 pieces | 3–5 days |
| Batch | 2,000–3,000 pieces | In batches starting from 3 days. |
| Large quantity | 3,000–5,000 or more | Starting from 3 days, batches will be arranged according to customer requirements. |
Delivery Instructions
Product delivery begins to be counted once the documentation and materials have been confirmed as free of abnormalities.
Product deliverable pass rate: Min 98%.
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen