Technical Services

Design Center

Board Manufacturing Center

Welding Center

Customer Service

Board Manufacturing Center

01
PROCESS CAPABILITY

Process capability

We have long been dedicated to providing rapid prototyping and high-volume PCB manufacturing services. To this end, we have established a comprehensive quality management system to ensure that our products leave the factory with a zero-defect rate. In order to meet the demands of customers for mid-to-high-end and specialized products, we launched two dedicated vertical‑turnaround prototype lines in 2015, enabling us to deliver fast turnaround times while maintaining the highest standards of quality.

We have a dedicated team of market consultants, engineering experts, and quality‑management specialists. From product launch and manufacturing to shipment, we provide our customers with timely, precise, and efficient high‑quality service. Our products’ exceptional cost‑performance is our team’s greatest strength.

Number of floors 2-42L
Thickness range 0.15-10mm
Minimum line width/line spacing 2.5/2.5mil
Fastest expedited delivery time 48 hours
02
TECHNICAL CAPABILITY

Process capability

COMPARISON

Prototype and Mass Production Capabilities

Comparison of Core Process Parameters Between Prototype Production and Mass Production

Project Modeling capability Batch capability
Number of floors 2-42L 2-36L
Plate thickness 0.15-10mm 0.15-8.0mm
Minimum line width/line spacing 2.5/2.5mil 3/3mil
Maximum plate thickness-to-hole diameter ratio 16:01 12:01
SPECIFICATION

Complete process parameters

PCB manufacturing, processing, and quality control capabilities

Project Category Process parameters
Minimum aperture Laser hole 0.1mm
Mechanical hole 0.15mm
Impedance Control ±10%
Maximum production size 620*1300mm
Copper plating thickness 0.5zo-20zo
Minimum spacing from hole to trace PTH 0.15mm
NPTH 0.125mm
Complete the aperture control range. PTH ±0.075mm
NPTH ±0.03mm
Solder mask color Green, blue, black, yellow, red, white...
HDI (Blind and Buried Via) Board 1+n+1, 2+n+2, 3+n+3, ELIC
Sheet material Shengyi, Lianmao, Jiantao, Taiguang, Taiyao, Panasonic M6, ISOLA 370HR (high Tg, halogen-free, high-frequency) laminates, and other mixed‑ply materials…
Surface treatment Oxidation-resistant (OSP), immersion gold, nickel-palladium-gold, gold plating, lead-free hot-air solder leveling (HASL), HAL, HASL, immersion silver
V-CUT depth ±0.05mm
V-CUT angle 30℃, 45℃, 60℃
SMT size 0.3mm
BGA size 0.2mm
Board Warpage Control ±0.5%
Minimum geometric tolerance ±0.05mm
Special processing High-frequency, high-speed, HDI, buried and blind vias, rigid‑flex, arbitrary-layer interconnects, FR4–Rogers hybrid laminates, step‑down slots, back drilling, and more.
03
DELIVERY TIME

Delivery time

LEAD TIME

Production lead time for different quantities

The actual delivery date will be determined based on the product’s manufacturing process and order status.

Number of floors Sample Batch Urgent
2-4L 5–6 days 9 days 48 hours
6L 7 days 9 days 4 days
8L 10 days 12 days 5 days
10L 10 days 14 days 6 days
12L 12 days 14 days 8 days
14L 13 days 16 days 8 days
16L 14 days 16 days 12 days
18L 16 days 18 days 12 days
20L 18 days 20 days 13 days
Note For boards with more than 20 layers and special boards, specifications are to be determined.