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Design Center

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Design Center

01
BUSINESS INTRODUCTION

Business Overview

We have a professional PCB design team, with each member boasting over several years of experience and extensive design expertise. Our team is proficient in a wide range of EDA tools, including Allegro, POWER PCB, Protel SE, CR5000, WG, CAM350, and more.

It supports bidirectional conversion between schematic and PCB designs across multiple design tools, possesses a deep understanding of both domestic and international PCB design and manufacturing standards, and has extensive experience in PCB layout and routing, power‑supply design, signal integrity (SI) analysis, and EMC design. It can handle the entire design workflow, from schematic capture to final soldering.

High efficiency, high quality, and high cost-effectiveness are the hallmarks of our team. Maximum Advantage.

01

Professional engineering team

Highly qualified professional engineers, with an average of over six years of industry experience per person. Senior Employees with 8 or more years of service.

02

Complete Job Configuration

Packaging engineers, layout engineers, SI engineers, EMC engineers, and DFM engineers form the foundation of professional design.

03

Standard Process Assurance

Process-first, large-scale teams, and deep technical expertise provide a reliable foundation for design quality.

04

Integrated services

Seamless integration of PCB design, fabrication, and soldering ensures full adherence to project timelines.

02
DESIGN CAPABILITY

Design capability

TECHNICAL PARAMETERS

PCB Design Technical Parameters

Covers multilayer boards, high-speed signaling, BGA, and HDI designs with interconnections on any layer.

highest Number of design floors 42nd floor
most Small via 6mil 4 mil laser hole
most IN count 60,000+
most High BGA count 100+
most Small BGA pitch 0.25mm
Maximum BGA pin count 2500
most Small line width 2.4mil
highest Speed signal 12G Differential signal
most Small line spacing 2.4mil
highest HDI level ELIC Interconnection at any layer
Product Categories

Data communications, optical networks, multimedia, computers and the Internet, healthcare, aerospace, industrial control, and more.

Chip types

INTEL, Marvell, Broadcom, Freescale, TI, Qualcomm, Spreadtrum, MTK platform series, and others.

Design software

Cadence Allegro/Orcad, Mentor WG/PADS, Altium/Protel, Zuken, and others.

04
REQUIRED INFORMATION

Required documents need to be provided.

01

Schematic diagram

A complete electronic document format capable of generating a correct netlist.

02

Mechanical dimensions

Provide the specific locations and directional markings of positioning devices, as well as signage indicating areas with height restrictions.

03

BMO List

It is primarily used to identify and verify the package information assigned to components in the schematic.

04

Wiring Guide

A description of the specific requirements for special signals, along with design specifications such as impedance and layer stack‑up.

05
DESIGN PROCESS

Design Process

PCB Design Process
06
DESIGN LEAD TIME

Standard design lead time

STANDARD LEAD TIME

Design cycle for different numbers of layers

Calculate the design cycle based on a finalized schematic and complete component footprints.

Number of floors Design cycle
2L 2–3 business days
4L 4–5 business days
6L 6–7 business days
8L 7–8 business days
10L 10–12 business days
Delivery Schedule Explanation

The lead times listed above are standard; the precise delivery schedule must be determined through a comprehensive assessment of factors such as the number of components, design complexity, and the number of layers in the PCB.