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10-layer rigid-flex combination


Rigid PCBs and flexible FPCs are integrated via lamination; components are mounted on the rigid sections, while the flexible sections enable bending and three-dimensional routing, eliminating the need for numerous connectors and ribbon cables and enhancing reliability. However, this approach is more complex to manufacture. For foldable displays, endoscopes, and robotic‑arm joints, copper‑clad laminates are essential, with particular attention paid to bend‑life performance.

Category:

Rigid‑Flex Integration

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  • Product Description
  • Application areas
  • Number of floors 10 floors
    Plate thickness 0.2+0.8mm
    Materials Shengyi FR4+FPC
    Surface treatment 2u immersion gold
    Minimum hole size 0.2mm
    Minimum BGA 0.2mm
    Line width/line spacing 3mil/3mil
    Solder mask/characters Black oil + electromagnetic shielding film / white text
     

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