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8-layer rigid-flex board
This 8-layer rigid‑flex PCB features an integrated lamination of a rigid PCB and a flexible FPC. Components are mounted on the rigid sections, while the flexible sections enable bending and three‑dimensional routing, eliminating the need for numerous connectors and ribbon cables and enhancing reliability. However, the manufacturing process is complex; it is commonly used in aerospace, instrumentation, and certain BMS applications—where costs remain relatively manageable and the focus is on structural, three‑dimensional wiring.
Category:
Rigid‑Flex Integration
- Product Description
- Application areas
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Number of floors 8 floors Plate thickness 0.15+0.65mm Materials FR4-S1000-2m+ and PI-A-2005RD-C Surface treatment 2u immersion gold Minimum hole size 0.2mm Line width/line spacing 4/4mil Solder mask/characters Blue oil + yellow overlay film / white text
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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