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10-layer, 2-connector drone board
This is a 10-layer, two‑layer drone PCB. The drone’s circuit board is divided into the flight controller mainboard, an AIO integrated board, a ESC power distribution board, and an image transmission RF board. It is a composite terminal‑level product that emphasizes lightweight design, vibration resistance, high‑speed RF signal handling, and localized high‑current capabilities. Its core objectives are weight reduction, vibration resistance, and interference suppression to prevent crashes.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 10 floors Plate thickness 1.0mm Materials FR4-S1000-2M Surface treatment 2u immersion gold Minimum laser hole 0.1mm Minimum BGA 0.22mm Line width/line spacing 2.6/2.6mil Solder mask/characters Matte black oil/white lettering Special process Resin plug sealing and electroplating leveling
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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