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4th-floor, 1st-level modular panel
This is a 4-layer, 1.5‑level through-hole module board: the board edges feature metallized through-holes (commonly known as “stamped holes”). The modules are directly soldered onto the user’s baseboard using SMT reflow soldering, eliminating the need for board‑to‑board connectors. Key features include vibration resistance, low profile, and reduced connector costs, making it ideal for high‑volume industrial applications. Once soldered, the assembly cannot be disassembled arbitrarily.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 4 floors Plate thickness 0.8mm Materials FR4-IT180A Surface treatment 3u immersion gold Minimum laser hole 0.1mm Minimum half-hole 0.5mm Line width/line spacing 4/4mil Solder mask/characters Green oil/white text Special process Resin plug plugging, electroplated planarization, half-hole 0.5 mm, immersion gold 3 µin.
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Contact Us
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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