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8th floor, Unit 2, Room i3559, Communications
This is the i3559, an 8-layer, 2‑layer PCB design (the mainstream Hi3559AV100 model), a HiSilicon 8K ultra‑HD AI video SoC chip. The 3559 motherboard consists of two parts: a SOM core board (core PCB) and a peripheral baseboard, making it an embedded motherboard for machine vision and video encoding/decoding applications.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 8 floors Plate thickness 1.6mm Materials FR4-S1000-2M Surface treatment Gold-plated Minimum laser hole 0.1mm Line width/line spacing 3mil/3mil Minimum BGA 0.2mm Solder mask/characters Black ink/White text Special process Resin plug sealing and electroplating leveling
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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