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10th floor, 2.5-bedroom unit
This is a 10-layer, second-order (half‑via) Android system core module PCB (core board), which is an HDI blind‑buried‑via multilayer board. After mounting surface‑mount components onto this PCB, you obtain a complete Android core module. Customers can then build the finished device simply by adding a basic peripheral baseboard, without needing to redesign a complex, high‑speed PCB.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 10 floors Plate thickness 1.0mm Materials FR4-IT158TC Surface treatment Immersion Gold + OSP Minimum laser hole 0.1mm Line width/line spacing 3/3mil Minimum BGA 0.2mm Solder mask/characters Green oil/white text Special process Resin plug holes, electroplated planarization, immersion gold + OSP, half-hole 0.5 mm
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Contact Us
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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