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10-layer 3-connector motherboard
This is a 10-layer, three‑stage mobile phone motherboard—also known as a smartphone PCB—which belongs to the category of high‑density HDI multilayer boards. It integrates the application processor, baseband communication, RF circuitry, power management, and storage circuits, serving as the core platform for the device. In contrast to the preceding examples: laptop motherboards prioritize computing performance; communication boards focus on network transmission; whereas mobile phone motherboards achieve a highly integrated design that combines computing power with RF communication, while maximizing space efficiency.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 10 floors, three tiers Plate thickness 0.8mm Materials FR4-NPG-170N Surface treatment Immersion Gold + OSP Minimum laser hole 0.1mm Line width/line spacing 2.2mil/2.2mil Minimum BGA 0.2mm Solder mask/characters Blue oil/White text Special process Resin plug via, electroplated fill, 2 µin gold immersion + OSP
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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