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10th-floor, 2nd-generation smart terminal
This is a 10-layer, 2‑layer smart terminal SoC motherboard, with an application processor SoC at its core. It integrates DDR memory and EMMC/UFS storage, and supports peripherals such as Wi‑Fi/Bluetooth, display, camera, audio, and battery management. The board runs Android or Linux and is used in tablets, handheld terminals, industrial smart devices, and more.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors Second-order at the 10th floor Plate thickness 1.2mm Materials FR4-S1000-2M Surface treatment 1u immersion gold Minimum laser hole 0.1mm Line width/line spacing 2.8mil/2.8mil Solder mask/characters Black ink/White text Special process Resin plug sealing and electroplating leveling
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Contact Us
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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