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4-layer single-layer motherboard
This is a 4-layer, single‑layer PCB. **RF SoC BGA/QFN pads**: for the wireless master control chip and the RF matching network—inductors, capacitors—to tune antenna performance; **antenna area**: traces for on‑board PCB antennas; an IPEX connector can also be provided for an external antenna; external interface pads: UART, I2C, GPIO, and power—used for communication with the main board.
Category:
HDI Blind Buried Vias
- Product Description
- Application areas
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Number of floors 4 floors Plate thickness 1.2mm Materials FR4-R5725S Surface treatment 2u immersion gold Minimum laser hole 0.1mm Line width/line spacing 2.6mil/2.6mil Solder mask/characters Green oil/white text Special process Resin plug sealing and electroplating leveling
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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