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8-layer, 2-layer industrial terminal motherboard


This is an 8-layer, dual‑interface industrial terminal motherboard—a fully integrated main control board that incorporates a processor, memory, storage, communication modules, and industrial interfaces. Once assembled with its enclosure, it can be used directly as a finished device.

Category:

HDI Blind Buried Vias

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  • Product Description
  • Application areas
  • Number of floors 8 floors
    Plate thickness 1.0mm
    Materials FR4-S1000-2M
    Surface treatment Immersion Gold + OSP
    Minimum laser hole 0.1mm
    Line width/line spacing 3/3mil
    Minimum BGA 0.18mm
    Solder mask/characters Black ink/White text
    Special process Resin plug via, electroplated fill, immersion gold + OSP
     

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