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12-layer, 2-layer PDA terminal motherboard


This is a 12-layer, second‑generation handheld PDA (data collector, barcode scanner) motherboard. It is an industrial‑grade smart handheld terminal motherboard, with form factor and manufacturing processes similar to those of a smartphone motherboard, but with higher environmental reliability requirements than standard smartphones.

Category:

HDI Blind Buried Vias

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  • Product Description
  • Application areas
  • Number of floors 12 floors
    Plate thickness 1.2mm
    Materials FR4-IT170GRA1
    Surface treatment 2u immersion gold
    Minimum laser hole 0.1mm
    Line width/line spacing 2.8mil/2.8mil
    Solder mask/characters Blue oil/White text
    Special process Resin plug sealing and electroplating leveling

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