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14-layer 3-connector motherboard

This is a 14-layer, third‑generation smartphone motherboard, a high‑end, high‑density HDI board that serves as the device’s core control board. It integrates the application processor, memory, storage, multi‑mode RF components, charging management, and a variety of peripheral interfaces. As a complete system‑level control board, it can be directly assembled into the finished smartphone. Designed for compactness and thinness with highly integrated functionality, it targets the consumer market while balancing performance and mass‑production cost.

Category:

HDI Blind Buried Vias

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  • Product Description
  • Application areas
  • Number of floors 14th floor
    Plate thickness 1.2mm
    Materials FR4-TU-872
    Surface treatment OSP + Immersion Gold 2
    Minimum laser hole 0.1mm
    Line width/line spacing 2.8mil/2.8mil
    Solder mask/characters Matte black oil/white lettering
    Special process Resin plug plugging, electroplated planarization, OSP + 2 µin gold immersion

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