Hello, welcome to Huashengxin Multi-layer Circuit Co., Ltd.! 今天是 2026年5月29日 星期五
Get a quote
Contact Us
Contact phone number
2-layer CSPIC substrate
This is a two-layer CSP test board—comprising both a load board and a burn-in board—specifically designed for chip‑level packages such as CSP, WLCSP, and µBGA. It is primarily used in the semiconductor packaging and testing process, serving downstream markets including consumer electronics, automotive electronics, telecommunications, sensors, and storage.
Category:
IC Substrate
- Product Description
- Application areas
-
Number of floors 2nd floor Plate thickness 0.25mm Materials BT/ABF Surface treatment Nickel-Palladium-Gold 2u Minimum hole size 0.15mm Copper thickness, inner and outer layers Hoz Line width/line spacing 2mil/2mil Solder mask/characters Green oil/white text Special process Resin plug sealing, electroplating leveling, and back-side finishing processes
Consult Now
If you are interested in our products, please leave your email address, and we will contact you as soon as possible. Thank you!
Contact Us
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
Copyright © 2026 Shenzhen Huashengxin Multi-layer Circuit Co., Ltd.