Contact Us

Contact phone number

Contact phone number

18038116563

E-Mail

E-Mail

sales@hsxdcpcb.com

+
  • undefined

4-layer IC substrate

This is a 4‑layer CSP board (Chip‑Scale Package), with a package size nearly identical to that of the bare die, featuring miniature solder balls on the bottom. It is widely used in mobile phones, wearables, sensors, and memory chips. A CSP test board is an ATE test PCB/PCBA specifically designed for CSP/WLCSP chips with tiny solder balls, and it comes in two types: a CSP load board and a CSP burn‑in board.

Category:

IC Substrate

Contact Us

Previous page

IC substrate

2-layer CSPIC substrate

Next page

  • Product Description
  • Application areas
  • Number of floors 4 floors
    Plate thickness 0.3mm
    Materials FR4-ST115
    Surface treatment Nickel-Palladium-Gold 2u
    Minimum hole size 0.15mm
    Copper thickness, inner and outer layers Hoz /1oz
    Line width/line spacing 2mil/2mil
    Solder mask/characters Black ink/White text
    Special process Resin plug holes, electroplated leveling, back-side finishing, halogen-free substrates, ink, and legends

Consult Now

If you are interested in our products, please leave your email address, and we will contact you as soon as possible. Thank you!

Submit Message