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4-layer CSPIC substrate
This is a 4‑layer CSP test board (**Load Board + Burn‑in Board**), specifically designed for chip‑level packages such as CSP, WLCSP, and µBGA. It is primarily used in the semiconductor packaging and testing process, serving downstream markets including consumer electronics, automotive electronics, communications, sensors, and storage.
Category:
IC Substrate
- Product Description
- Application areas
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Number of floors 4 floors Plate thickness 0.35mm Materials BT/ABF Surface treatment 2u immersion gold Minimum hole size 0.15mm Copper thickness, inner and outer layers Hoz/1oz Line width/line spacing 3mil/3mil Solder mask/characters Green oil/white text Special process Resin plug sealing, electroplating leveling, and back-side finishing processes
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Contact Us
Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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