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16-layer server board


This 16-layer server motherboard is a high‑layer-count, high‑density, high‑thermal‑performance, and highly reliable printed circuit board, serving as the core platform for server hardware. It is primarily used for data processing, storage, and high‑speed signal transmission. Key features include a large number of layers, oversized dimensions, high‑speed materials, and an extensive array of high‑speed interfaces; it also supports multiple GPUs and accommodates high‑power‑consumption thermal management. Representative manufacturing processes include high‑speed/high‑frequency design, thick copper plating, nickel‑palladium‑gold surface finishes, and buried vias with backside drilling.

Category:

Multilayer Via

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  • Product Description
  • Application areas
  • Number of floors 16 floors
    Plate thickness 1.6mm
    Materials FR4-TU883
    Surface treatment 2u immersion gold
    Minimum hole size 0.2mm
    Line width/line spacing 4mil/4mil
    Solder mask/characters Green oil/white text
    Special process Back drilling, resin plug via holes

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