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22nd-floor communication backplane
A communication backplane is a large, high‑density multilayer interconnect PCB—classified as a passive or minimally active board. Serving as the central interconnection hub of the system chassis, it does not house CPUs or other primary chips. Individual service daughter cards and line cards are directly plugged into the backplane connectors, enabling high‑speed signal and power distribution between boards while supporting hot‑swapping and modular scalability. It functions as the structural backbone of routers, switches, and other communication equipment.
Category:
Multilayer Via
- Product Description
- Application areas
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Number of floors 22nd floor Plate thickness 3.0mm Materials FR4-TU872 Surface treatment 3u immersion gold Minimum hole size 0.4mm Line width/line spacing 4mil/4mil Solder mask/characters Blue oil/White text Special process Multiple back-drilled holes + screw holes + crimping holes
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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