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8-layer core board
OM core board: Integrates the CPU, memory, storage, and PMIC power management onto a single compact board, handling only computation and high-speed signaling while omitting peripheral interfaces. Customers need only design a simple baseboard (carrier board), incorporating peripherals such as Ethernet, serial ports, CAN, 4G, and displays. By connecting the SOM via connectors, development complexity is significantly reduced, and project timelines are shortened.
Category:
Multilayer Via
- Product Description
- Application areas
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Number of floors 8 floors Plate thickness 1.6mm Materials FR4-S1000H Surface treatment 1u immersion gold Minimum hole size 0.2mm Minimum BGA 0.2mm Line width/line spacing 4mil/4mil Solder mask/characters Green oil/white text
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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