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6-layer industrial control communication motherboard


This is a six-layer industrial‑control communication motherboard. The RK3568 communication board is an embedded industrial‑control motherboard that adopts a “core board (SOM) + baseboard (carrier board)” architecture: the core board integrates the CPU, DDR, and eMMC, while the baseboard provides all communication, display, and I/O interfaces. It is widely used in industrial gateways, IoT devices, and edge‑computing communication equipment, and belongs to a completely different product category from the server boards, communication backplanes, and PC motherboards discussed earlier.

Category:

Multilayer Via

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  • Product Description
  • Application areas
  • Number of floors 6 floors
    Plate thickness 1.0mm
    Materials FR4-S1000-2M
    Surface treatment 1u immersion gold
    Minimum hole size 0.15mm
    Minimum BGA 0.2mm
    Line width/line spacing 3mil/3mil
    Solder mask/characters Blue oil/white text

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