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12-layer gold finger board
This is a 12-layer EM‑826 laminate, a mid‑loss, high‑speed epoxy resin material from the EM‑8 series. It is halogen‑free and based on a modified epoxy system, comparable to Panasonic’s Megtron‑2. Positioned between standard FR‑4 and the low‑loss EM‑828, it is optimized for PCIe 4.0 and 10–25 Gbps signaling. Widely used in servers, switches, and communication interface boards, it serves as a cost‑effective high‑speed substrate. The board edges feature electroplated hard gold long‑strip contacts and are chamfered at 30–45°, enabling direct insertion into socket slots for pluggable board‑to‑board connections.
Category:
High‑frequency, High‑speed
- Product Description
- Application areas
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Number of floors 12 floors Plate thickness 1.2mm Materials FR4-EM826 Surface treatment Gold immersion + gold plating Minimum hole size 0.2mm Line width/line spacing 2.8mil/2.8mil Solder mask/characters Green oil/white text Special process Resin plug holes, chamfered edges, 2 µin gold plating + 20 µin gold plating
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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