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Soft–hard combination on any layer of 8 layers
This 8-layer hybrid design features an integrated rigid‑PCB and flexible‑FPC laminate; components are surface‑mounted on the rigid sections, while the flexible sections allow bending and three‑dimensional routing, eliminating the need for numerous connectors and ribbon cables and enhancing reliability—though the manufacturing process is more complex.
Category:
Rigid‑Flex Integration
- Product Description
- Application areas
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Number of floors 8 floors Plate thickness 0.2+1.2mm Materials DuPont AP9131+ FR4-TU-872 Surface treatment Nickel-Palladium-Gold 15u” Minimum pore size 0.1mm Line width/line spacing 2.8mil/2.8mil Solder mask/characters Green oil/white lettering + yellow overlay film Special process 15 µin nickel–palladium–gold + resin plugging of vias + electroplated planarization
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen
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