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6-layer 1-connector flexible-rigid board


This 6-layer, 1‑level HDI design combines rigid PCB and flexible FPC into a single laminated structure. Components are mounted on the rigid sections, while the flexible sections can be bent and routed in three dimensions, eliminating the need for numerous connectors and ribbon cables and enhancing reliability—though the manufacturing process is more complex.

Category:

Rigid‑Flex Integration

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  • Product Description
  • Application areas
  • Number of floors 6 floors
    Plate thickness 0.2+1.0mm
    Materials PI-R-F775 12RB-M+FR4
    Surface treatment 2u immersion gold
    Minimum pore size 0.1mm
    Line width/line spacing 3mil/3mil
    Solder mask/characters Green oil/white text + yellow overlay film
    Special process Resin plug hole + electroplated leveling

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