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26-layer ATE test board

This is a 26-layer ATE test board, serving as the interface PCB for automated test equipment. It is categorized into three main types: probe card PCBs (for CP wafer-level testing), load boards (for FT post‑packaging testing), and burn‑in boards. These boards act as the interface between the ATE tester and the device under test, supporting end‑to‑end testing across the entire process—from wafer fabrication through packaging to reliability aging. An ATE test board is a PCB/PCBA fixture that connects the semiconductor ATE tester to the device under test (DUT), enabling signal routing and facilitating functional, DC/AC parameter, and high‑speed RF performance testing.

Category:

High‑frequency, High‑speed

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  • Product Description
  • Application areas
  • Number of floors 26th floor
    Plate thickness 4.0
    Materials FR4-TU-872
    Surface treatment Gold-plated
    Minimum pore size 0.25mm
    Line width/line spacing 4mil/4mil
    Solder mask/characters Blue oil/White text
    Special process With controlled-depth drilling, gold-plated 30u”

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