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4-layer high-frequency microwave RF


This is a 4-layer **high-frequency microwave RF PCB bare board**, featuring a black high-frequency substrate and extensive exposed copper on the surface (without green solder mask). It is designed for RF power circuits and microstrip antennas, commonly used in wireless communications, radar, power amplifiers, drone video transmission, and base station modules.

Category:

High‑frequency, High‑speed

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  • Product Description
  • Application areas
  • Number of floors 4 floors
    Plate thickness 0.6
    Materials Taconic
    Surface treatment 2u immersion gold
    Minimum pore size 0.2mm
    Copper thickness, inner and outer layers 1oz / 1oz
    Solder mask/characters White characters
    Special process Full-page gold inlay,

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