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4-layer high-frequency microwave RF
This is a 4-layer **high-frequency microwave RF PCB bare board**, featuring a black high-frequency substrate and extensive exposed copper on the surface (without green solder mask). It is designed for RF power circuits and microstrip antennas, commonly used in wireless communications, radar, power amplifiers, drone video transmission, and base station modules.
Category:
High‑frequency, High‑speed
- Product Description
- Application areas
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Number of floors 4 floors Plate thickness 0.6 Materials Taconic Surface treatment 2u immersion gold Minimum pore size 0.2mm Copper thickness, inner and outer layers 1oz / 1oz Solder mask/characters White characters Special process Full-page gold inlay,
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Contact number: 18038116563
E-Mail: sales@hsxdcpcb.com
Address: No. 187, Songming Avenue, Bao’an District, Shenzhen