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8-layer 2-layer core board


This is an 8-layer, 2‑layer SOM core board, also known as a CPU core board. It integrates the main SoC, DDR memory, and eMMC/UFS storage onto a single small PCB, **leaving only the peripheral interfaces exposed on the baseboard**. Customers need only develop a simple baseboard, eliminating the need for complex, high-speed BGA fan-out, thereby significantly shortening the product development cycle.

Category:

HDI Blind Buried Vias

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  • Product Description
  • Application areas
  • Number of floors 8 floors
    Plate thickness 1.0mm
    Materials FR4-IT180
    Surface treatment 1u immersion gold
    Minimum laser hole 0.1mm
    Line width/line spacing 3/3mil
    Solder mask/characters Black ink/White text
    Special process Resin plug sealing and electroplating leveling

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