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The Differences Between HDI Boards and Conventional PCBs
2026-06-18
Introduction to HDI Boards
HDI board (High Density Interconnector) is a type of circuit board characterized by a high density of interconnects, achieved through the use of micro‑blind and buried vias. HDI boards feature both inner-layer and outer-layer traces, and employ processes such as drilling and plating‑through‑holes to establish internal connections between layers.
HDI boards are typically manufactured using a multilayer build-up process; the greater the number of build-up layers, the higher the board’s technical grade. Conventional HDI boards generally employ a single‑layer build-up, whereas advanced HDI boards utilize two or more build-up layers and incorporate cutting-edge PCB technologies such as stacked vias, electroplated via filling, and laser direct drilling.
When PCB density exceeds that of eight-layer boards, manufacturing via HDI technology results in lower costs compared to conventional, complex laminate‑bonding processes. HDI boards facilitate the adoption of advanced packaging technologies and offer superior electrical performance and signal integrity relative to traditional PCBs. Moreover, HDI boards provide enhanced mitigation of radio‑frequency interference, electromagnetic interference, electrostatic discharge, and thermal management.
Electronic products are continuously advancing toward higher density and greater precision. The “high” in this context not only refers to enhanced device performance but also to reduced form factor. High‑density interconnect (HDI) technology enables more compact end‑product designs while meeting increasingly stringent standards for electrical performance and efficiency. Today, many popular electronic devices—such as smartphones, digital cameras, laptops, and automotive electronics—rely on HDI circuit boards. As electronic products evolve and market demands shift, the HDI market is poised for rapid growth.
Introduction to Standard PCBs
PCB (Printed Circuit Board), known in Chinese as yìnzhì diànlù bǎn or yìnshuā xiànlù bǎn, is an essential electronic component that serves as a support structure for electronic parts and provides the electrical connections among them. Because it is manufactured using electronic printing techniques, it is referred to as a “printed” circuit board.
Its primary function is that, after electronic devices are manufactured using printed circuit boards, the inherent consistency of identical PCBs eliminates errors associated with manual wiring and enables automated component insertion or placement, automatic soldering, and automated testing. This ensures the quality of electronic equipment, boosts labor productivity, reduces costs, and facilitates maintenance.
Are all PCBs with blind buried vias referred to as HDI boards?
HDI boards, or high-density interconnect boards, are characterized by their blind vias and secondary lamination processes. They come in various levels of complexity, such as first‑order, second‑order, third‑order, fourth‑order, and fifth‑order HDI. For example, the motherboard of the iPhone 6 is a fifth‑order HDI.
Via-in-pad is not necessarily HDI.
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